文章標籤：

Approach Approach Design Heatsink Hints OCZ Approach Design Heatsink Hints OCZ

文章分享：

收藏0 分享

「舒適體面，終於無線～」Montech 君主科技 MKey PRO 75% 三模全熱插拔鍵盤開箱

ITX Z890I Nova WiFi + U7 265K 開箱

技嘉GIGABYTE Z890 AORUS MASTER-結合AI智慧與DIY友善，大師出手誰與爭鋒

新75%鍵盤！新MKey！君主 MKey PRO 三模全熱插拔鍵盤

+ MORE活動推薦：

: GEX PRO 850W玩家開箱體驗分享活動
卓越性能，超值選擇 GEX PRO 系列通過 80 PLUS 金牌認證，實現高達 ...

: 體驗極速WiFi 7！MSI Roamii BE Lite Mesh
第一名 guanrung1110 https://www.xfastest.com/thread-293988-1- ...

: 極致效能為遊戲而生 990 PRO SSD 玩家體驗
[*]極致效能固態硬碟 [*]PCIe 4.0 速度大幅提升 [*]優化的電源效率 ...

: Micron Crucial PRO D5 6400超頻版玩家開
解銷更快的遊戲速度！利用低延遲遊戲記憶體的強大功能利用 Cruci ...

OCZ Hints at Radical Approach to Heatsink Design

[複製鏈接]| 回復

電梯直達

1^#

hicookie 發表於 2007-1-11 15:35:37 | 只看該作者回帖獎勵

|倒序瀏覽 |閱讀模式

Heatpipes to make an appearance in memory design this year

OCZ Technology today announced its newest memory designs behind closed doors. The design, currently codenamed Flexpipe, will make an appearance on high-end OCZ XTC as early as February 2007.

The design of the Flexpipe heatsink revolves around a heatpipe that transfers heat from the module to another heatsink one centimeter above the memory bank. Air can pass freely under and over the heatsink bank -- an approach that allows air to move over the heatsinks of multiple modules when installed on a motherboard.

The new memory design just finished its pre-production trials and the company will move into test trial phases this month.

OCZ recently announced its hybrid FlexXLC heatsink, a design that can work as a watercooled or aircooled sink. OCZ Technology Vice President of Marketing and Communications, Alex Mei, claims "the Flexpipe is mainly designed for a memory platform above the OCZ XTC series memory, but will be priced more aggressively than FlexXLC modules."

Most likely, Flexpipe devices will go head-to-head against Corsair's wildly popular DOMINATOR series memory introduced in mid-2006.

來源：https://www.dailytech.com/article.aspx?newsid=5662